Description
WaferPro 4″ (100mm) Fused Silica Wafer
Overview:
WaferPro, a world-leading supplier of semiconductor materials, now offers high-quality 4″ (100mm) fused silica wafers. These wafers are made from high-purity fused silica, providing very low metal contamination and high transmission for UV light. They are suitable for UV optical and semiconductor applications, featuring extremely low trace metal and OH content, and a low coefficient of thermal expansion (CTE).
Key Specifications:
| Specification | Value |
|---|---|
| Material | High Purity Fused Silica |
| Diameter | 100.0 ± 0.2 mm |
| Thickness Tolerance | ± 25 μm |
| Bow | ≤40 µm |
| Warp | ≤40 µm |
| Surface Roughness (Ra) | ≤0.5 nm |
| TTV | ≤10 μm |
| Packaging | Cleanroom Packed |
Key Features:
- High Purity – Our fused silica wafers are made from high-purity fused silica, ensuring low metal contamination and high UV light transmission.
- Double Side Polished – The wafers are double side polished, providing a smooth and uniform surface.
- Low CTE – The wafers have a low coefficient of thermal expansion, making them suitable for high thermal processing.
- Cleanroom Packed – The wafers are packaged in a cleanroom environment to protect them from particulate contamination.
- Versatile Applications – Our fused silica wafers are suitable for a wide range of applications, including UV optical and semiconductor applications.
- Trusted by Industry Leaders – Our fused silica wafers are used by leading research labs and high volume production facilities worldwide.
- Quality Control and Inspection – Every wafer undergoes comprehensive quality inspection and testing.
Major Applications:
Our expertise in wafer manufacturing allows us to produce high-quality 4-inch fused silica wafers for a variety of applications:
- UV optical applications
- Semiconductor manufacturing
- Sensor manufacturing
- Research and development
- High thermal processing applications
Our stringent quality control ensures the high purity and thickness uniformity needed to serve as substrates across high-tech industries. Please discuss your specific application with us so we can recommend configurations to optimally meet your needs.
Quantity Discounts:
As your supplier of 100mm fused silica wafers, we offer discounts on orders of 100 wafers or more. Please inquire with us about customized pricing for your high volume wafer needs (1,000pcs or more). We can provide prompt quotes for the quantities you require. Volume pricing represents a way for us to pass significant savings to you, our valued customer.
FAQs on 100mm Fused Silica Wafer:
What are fused silica wafers used for?
Fused silica wafers are most commonly used to manufacture optical and semiconductor components like lenses, prisms, filters, photomasks, and microfluidic devices. They can withstand high temps.
What thickness options do you offer for 100mm fused silica wafers?
We offer standard thicknesses ranging from 0.5mm to 2.0mm. Thinner or thicker wafers can also be customized including ultra-thin 100mm fused silica down to 10 microns.
What surface roughness options are available?
Our standard 4″ fused silica wafers have surface roughness starting at <5Å Ra. We offer custom polished fused silica wafers with standard surface roughness starting at <5Å Ra and ranging to super polished <1Å Ra, tailored to your application needs.
Do you supply prime or reclaimed fused silica wafers?
We supply prime grade 100mm fused silica wafers only.
Can I order smaller quantities of 100mm fused silica wafers?
Minimum order quantity is one full cassette which has 25 wafers.
How long is the lead time for 4″ fused silica wafer orders?
Lead times for stock wafers are typically 1-2 days. Customized 100mm wafers generally require a 4-6 week manufacturing time depending on your specs.
Contact Us:
Please reach out to us with any other questions on how our 4-inch 100mm fused silica wafers can enable your next technology breakthrough! Contact us with any inquiries on specifications, pricing, or lead times.
